个人简历

教育经历
Education Background
2007.92014.1大连理工大学机械制造及其自动化博士
2005.92007.7大连理工大学机械制造及其自动化硕士
2004.92005.7大连理工大学国际经济与贸易学士
2000.92004.7大连理工大学机械设计制造及其自动化学士
工作经历
Work Experience
2014.1至今大连理工大学讲师

专利
一种基片均匀抛光装置及其工作方法
一种楔形基片研磨装置及其工作方法
一种圆形低刚度工件的平行度及平面度测量装置及方法
一种大型抛光机盘面平面度检测装置及其工作方法
一种环抛机盘面修整系统及其工作方法
一种超声插切加工刀具

科研项目
超薄硬脆晶体基片的耦合能量软磨机理与关键技术研究, 国务院其他部门, 2016/06/13-2017/07/06, 完成
低损伤超精密磨削硬脆晶体的摩擦化学反应机理研究, 国家自然科学基金项目, 2015/08/18, 完成
基于摩擦化学反应的硬脆晶体低损伤磨削机理研究, 国务院其他部门, 2014/09/11-2017/07/06, 完成
低损伤超精密磨削硬脆晶体的摩擦化学反应机理研究, 省、市、自治区科技项目, 2014/07/11, 进行
难加工金属材料复杂曲面高精度高完整性表面形成机理和加工技术, 国家科技部 , 2018/01/01, 进行
难加工金属材料微量去除调控方法和高精度高完整性表面加工方法, 国务院其他部门, 2018/01/01, 进行
其他奖励
2014年第四届上银优秀机械博士论文奖 （2014年）

研究领域

半导体制造技术
精密与超精密加工技术""

近期论文

[1]高尚,耿宗超,吴跃勤,王紫光,康仁科.石英玻璃超精密磨削加工的表面完整性研究[J],机械工程学报,2019,55(5):186-195
[2]王紫光,康仁科,周平,高尚,董志刚.单晶硅反射镜的超精密磨削工艺[J],光学精密工程,2019,27(5):1087-1095
[3]Cai, Linquan,Guo, Xiaoguang,Gao, Shang,Li, Zhiyuan,Kang, Renke.Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2019,45(16):20545-20554
[4]Gao, Shang,Wu, Yueqin,Kang, Renke,Huang, Han.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2018,79:165-170
[5]朱祥龙,李俊卿,董志刚,康仁科,高尚,郭东明.Design of Ultra-precision Machine for Integrated Grinding and Polishing of Silicon Wafers[A],6th International Conference on Nanomanufacturing,2018
[6]Wu, Y. Q.,Gao, S.,Huang, H..The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],Materials Science in Semiconductor Processing,2017,71(-):321-325
[7]朱祥龙,高尚,康仁科,董志刚,崔岩.全日制专业型硕士实践能力培养体系之探析[J],实验室科学,2017,20(5):229-232
[8]王紫光,高尚,朱祥龙,董志刚,康仁科.硅片低损伤磨削砂轮及其磨削性能[J],光学精密工程,2017,25(10):2689-2696
[9]Gao, Shang,Huang, Han,Zhu, Xianglong,Kang, Renke.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,63:97-106
[10]高尚,朱祥龙,康仁科,郭东明,王紫光,张璧.微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2017,53(7):180-188
[11]Gao, Shang,Kang, Ren-Ke,Dong, Zhi-Gang,Zhang, Bi,Wang, Zi-Guang.Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates[J],MATERIALS AND MANUFACTURING PROCESSES,2017,32(2):121-126
[12]高尚,康仁科,董志刚.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],2017,872:19-24
[13]高尚,王紫光,康仁科,董志刚,张璧.工件旋转法磨削硅片的磨粒切削深度模型[J],机械工程学报,2016,52(17):86-93
[14]于月滨,王紫光,周平,高尚,郭东明.磨削速度和压力对单晶硅去除特性的影响[J],金刚石与磨料磨具工程,2016,36(3):1-5,10
[15]林智富,高尚,康仁科,王紫光,耿宗超.固结金刚石研磨盘加工蓝宝石基片的磨削性能研究[J],人工晶体学报,2016,45(5):1317-1322
[16]Dong, Zhigang,Gao, Shang,Huang, Han,Kang, Renke,Wang, Ziguang.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2016,83(5-8):1231-1239
[17]Liu, Haijun,Dong, Zhigang,Kang, Renke,Zhou, Ping,Gao, Shang.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS MEASUREMENT USING THREE-POINT-SUPPORT METHOD[J],METROLOGY AND MEASUREMENT SYSTEMS,2015,22(4):531-546
[18]高尚,康仁科,朱祥龙,郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],2015
[19]高尚,董志刚,康仁科,张璧,郭东明.Warping of silicon wafers subjected to back-thinning process[J],Precision Engineering,2015,40(-):87-93
[20]董志刚,高尚,康仁科,郭东明.Investigation on properties of magnesia grinding wheels used in silicon wafer grinding[A],2014,117(-):273-278
[21]高尚,康仁科,郭晓光.Grinding performance of diamond grinding tools for sapphire crystal[A],2014,117(-):544-548
[22]Gao, Shang,Dong, Zhigang,Kang, Renke,Guo, Dongming.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OFENGINEERING MANUFACTURE,2013,227(B4):578-586
[23]高尚,康仁科,董志刚,郭东明.工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2013,49(3):88-94
[24]Gao, Shang,Kang, Renke,Dong, Zhigang,Zhang, B..Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2013,64:31-37
[25]白倩,董志刚,闫英,高尚,朱祥龙,段春争,刘冲,崔岩.金属增减材复合制造专业硕士实践教学平台建设[J],实验室科学,2018,21(2):158-160,163